| 000 | 01094nam a2200241zi 4500 | ||
|---|---|---|---|
| 005 | 20230201161215.0 | ||
| 008 | 160926s2003 enka 100 0 eng | ||
| 020 | _a0444513396 | ||
| 020 | _a9780444513397 | ||
| 035 | _aMX001001912467 | ||
| 040 |
_aUKM _bspa _erda _cUKM _dDLC _dUNAMX |
||
| 050 | 0 |
_aTK7871.85 _bI5786 2001 |
|
| 111 | 2 |
_aInternational Conference on Rapid Thermal Processing for Future Semiconductor Devices _n(2 : _d2001 : _cIse-Shima, Mie, Japón) |
|
| 245 | 1 | 0 |
_aRapid thermal processing for future semiconductor devices : _bproceedings of the 2001 International Conference on Rapid Thermal Processing for Future Semiconductor Devices (RTP 2001), held at Ise-Shima, Mie, Japan, November 14-16, 2001 / _cedited by Hisashi Fukuda |
| 300 |
_ax, 150 páginas : _bilustraciones |
||
| 650 | 0 |
_aSemiconductores _xTratamiento termico _vCongresos |
|
| 650 | 0 |
_aProcesamiento termico rapido _vCongresos |
|
| 700 | 1 |
_aFukuda, Hisashi, _eeditor |
|
| 264 | 1 |
_aLondon : _bElsevier, _c2003 |
|
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
||
| 999 |
_c3716 _d3716 |
||