| 000 | 01234nam a2200265zi 4500 | ||
|---|---|---|---|
| 005 | 20230201161148.0 | ||
| 008 | 970106s1990 a 000 0 eng | ||
| 020 | _a0871703963 | ||
| 035 | _aMX001000589468 | ||
| 050 |
_aTK7870.15 _bI57 1990 |
||
| 111 | 0 |
_aInternational Electronic Materials and Processing Congress _c(3 : 1990 : San Francisco, California) |
|
| 245 | 1 | 0 |
_aNew technology in electronic packaging : _bproceedings of ASM International's 3rd electronic materials & processing congress, San Francisco, California, USA, 20-23, August 1990 / _ced. by B.R. Livesay and M.D. Nagarkar ; sponsored by the Electronic Materials and Processing Division of ASM International |
| 300 | _ax, 378 páginas | ||
| 650 |
_aEncapsulado electrónico _vCongresos |
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| 650 |
_aEncapsulado microelectrónico _vCongresos |
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| 650 |
_aMicroelectrónica _xCorrosion _vCongresos |
||
| 700 |
_aLivesay, B.R. _eeditor |
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| 700 |
_aNagarkar, M. D., _eeditor |
||
| 710 | 2 |
_aASM International. _bElectronic Materials and Processing Division |
|
| 264 | 1 |
_aMaterials Park, Ohio : _bASM International, _cc1990 |
|
| 336 |
_atexto _2rdacontent |
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| 337 |
_asin medio _2rdamedia |
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| 338 |
_avolumen _2rdacarrier |
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| 999 |
_c1215 _d1215 |
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