TY  - BOOK
AU  - Livesay, B.R.
AU  - Nagarkar, M. D.,
ED  - International Electronic Materials and Processing Congress
ED  - ASM International.
TI  - New technology in electronic packaging: proceedings of ASM International's 3rd electronic materials & processing congress, San Francisco, California, USA, 20-23, August 1990 
SN  - 0871703963
AV  - TK7870.15 I57 1990
PY  - 1990///
CY  - Materials Park, Ohio
PB  - ASM International
KW  - Encapsulado electrónico
KW  - Congresos
KW  - Encapsulado microelectrónico
KW  - Microelectrónica
KW  - Corrosion
ER  -