New technology in electronic packaging :  proceedings of ASM International's 3rd electronic materials & processing congress, San Francisco, California, USA, 20-23, August 1990 / 
ed. by B.R. Livesay and M.D. Nagarkar ; sponsored by the Electronic Materials and Processing Division of ASM International 
 - x, 378 páginas 
<br/><br/><label>ISBN: </label>0871703963 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Encapsulado electrónico--Congresos<br/>Encapsulado microelectrónico--Congresos<br/>Microelectrónica--Corrosion--Congresos
<br/><br/><label>LC Class. No.: </label>TK7870.15  / I57 1990